• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:

    公开号:SE533966C2
    申请号:SE0600890
    申请日:2006-04-24
    公开日:2011-03-15
    发明作者:Hideyuki Kikuchi；Yuzo Yukimori
    申请人:Hitachi Magnet Wire Corp；
    IPC主号:
    专利说明:

    Thus, the erosion of the coating film can proceed mainly due to cutting of the molecular chain in the resinous film coating or generation of heat caused by collision of charged particles. As a result, degradation may occur.
    In recent years, in an inverter-powered motor system used for energy saving or adjustable speed, many cases have been reported where inverter voltage surges (steep overvoltage) are generated and cause engine failure. It has been found that the engine failure is caused by the partial discharge due to the overvoltage in the inverter voltage jump.
    To prevent erosion due to partial discharge, an enamelled conduit is known which has an insulation made of an enamel lacquer such that inorganic insulating particles such as silicon and titanium are dispersed in a heat-resistant resin solution with an organic solvent. Such an inorganic insulating particle can provide the enamelled pipe with resistance to partial discharge, and can in addition contribute to improvement in thermal conductivity, reduction in heat recovery and improvement in strength.
    Known methods for dispersing fine particles of silica such as the inorganic insulating particle in a resin solution are such as a method for adding and dispersing a powder of fine silica particles in the resin solution, and a method for mixing the resin solution and silica sol (e.g. JP-A-2001-307557). As compared with the method of adding silica particulate powder to it, the method of using silica sol can facilitate the mixing and offers a varnish in which the silica is well dispersed. However, in this case the silica sol needs a high compatibility with the resin solution.
    When a polyamidimide insulating material is used as the heat-resistant polymer, a solvent for this may be N-methyl-2-pyrrolidone (NMP), N, N-dimethylformamide (DMF), N, N dimethylacetamide (DMAC), dimethylimidiazolidinone (DMI), etc. In general, a solvent is used which mainly contains NMP and is diluted with DMF, aromatic alkylbenzene, etc.
    However, when such a polyamideimide enamel lacquer with the solvent containing NMP as the main component is used to disperse fine silica particles therein, the fine silica particles are conventionally aggregated which does not allow sufficient dispersion. There is a correlation between the partial discharge resistance of the conductor coating film and the surface area of the silica particles in the conductor coating film. If the coating film is formed by using a silica-dispersed enamel lacquer with insufficient dispersion, i.e. with many units, the partial discharge resistance in the coating film must be reduced. Therefore, the fine silica particles must be uniformly dispersed without aggregate in the coating film.
    On the other hand, when organic silica sol is used as a source of silica, it is prepared by dispersing fine silica particles in an organic solvent such as DMAC, DMF, alcohol and ketone. However, such an organic silica sol has low compatibility with polyamidimide resins that dissolve in NMP, so aggregates are likely to be generated. In addition, even if a uniform dispersion can be obtained under limiting conditions, problems will be created in terms of long-term storage stability, stability and reproducibility.
    SUMMARY OF THE INVENTION It is an object of the present invention to provide an insulating varnish which is resistant to partial discharge such that fine silica particles can be uniformly dispersed, which prevents the aggregation thereof in order thus to increase the partial discharge resistance. It is another object of the invention to provide an insulated conduit such that a coating film is formed on a conductor by using the insulating varnish which is resistant to partial discharge.
    It is another object of the invention to provide methods for manufacturing the insulating varnish which is resistant to partial discharge and the insulated conduit. (1) According to one aspect of the invention, an insulating varnish which is resistant to partial discharge comprises: an enamel lacquer of polyamidimide and a sol of organic silicon dispersed in a solvent, wherein the solvent comprises 50 to 100% by weight of γ-butyrolactone.
    In the invention above, the following modifications or changes may be made. (i) a silica component in the sun of organic silicon is 1 to 100 phr (parts per hundred parts of resin) by weight of a resin component in the polyamidimide enamel lacquer. (ii) the sun of organic silicon has an average particle size of 100 nm or less. (2) According to another aspect of the invention, an insulated wire comprises a conductor; and a coating insulating film which is resistant to partial discharge formed on the surface of the conductor, wherein the insulating coating film which is resistant to partial discharge is made of the insulating lacquer which is resistant to against partial discharge as described above.
    In the invention above, the following modifications or changes may be made. (iii) the insulated wire further comprises an organic insulating coating film formed on the surface of the conductor, wherein the insulating coating film resistant to partial discharge is formed on the surface of the organic insulating coating film. (iv) the insulated tree comprises yet another organic insulating coating film formed on the surface of the insulated coating film which is resistant to partial discharge.
    According to another aspect of the invention, a method of making an insulating lacquer which is resistant to partial discharge comprises: mixing an enamel lacquer of polyamidimide with a sol of organic silicon, wherein the polyamidimide enamel lacquer comprises γ-butyrolactone as the main solvent, the sol of organic silicon comprises γ-butyrolactone as the main dispersant, and the insulating lacquer which is resistant to partial discharge comprises 50 to 100% by weight of 7-butyrolactone to a total amount of a solvent thereof.
    In the invention above, the following modifications or changes may be made. (4) 533 966 _5_ (v) The polyamidimide enamel lacquer comprises 60 to 100% by weight of γ-butyrolactone to a total amount of solvent thereof. (vi) the organosilicon sol comprises 80 to 100% by weight of γ-butyrolactone to a total amount of a dispersant thereof.
    According to another aspect of the invention, a method of making an insulated wire comprises: preparing an insulating lacquer which is resistant to partial discharge by mixing a polyamidimide enamel lacquer with a sol of organic silicon; and coating the insulating lacquer which is resistant to partial discharge on the surface of a conductor and then baking the lacquer to form a coating film on the conductor, wherein the polyamidimide enamel lacquer comprises 7-butyrolactone as the main solvent, the organic silicon sol comprises y -butyrolactone as the main dispersant, and the insulating lacquer which is resistant to partial discharge comprises 50 to 100% by weight of γ-butyrolactone to a total amount of a solvent thereof.
    In the invention above, the following modifications or changes may be made. (vii) the method further comprises forming an organic insulating coating film on the surface of the conductor, wherein the insulating coating film resistant to partial discharge is formed on the surface of the organic insulating coating film.
    Advantages of the invention The insulating varnish which is resistant to parietal discharge with improved resistance to partial discharge can be obtained because the sun of organic silicon is uniformly dispersed which prevents aggregation thereof.
    The insulated conduit may be less prone to erosion due to partial discharge because the conductor is coated with the insulating varnish which is resistant to partial discharge where the organic silicon sol is uniformly dispersed so that the insulated coating film can be formed with uniformly dispersed silica. As a result, the insulated wire can be applied to many systems fed with inverters to significantly extend the life of the electrical devices thereby.
    Brief Description of the Drawings The preferred embodiments of the invention will be explained below with reference to the drawings, in which: Fig. 1 is a cross-sectional view showing an insulated conduit in a preferred embodiment of the invention; Fig. 2 is a cross-sectional view showing an insulated conduit in another preferred embodiment of the invention; and Fig. 3 is a cross-sectional view showing an insulated conduit in another preferred embodiment of the invention. Detailed Description of the Preferred Embodiments Organic Silica Sol The organic silicon sol used in the invention preferably has an average particle diameter (according to the BET method) of 100 nm or less, more preferably 30 nm or less. in this way effectively supply the coating film with resistance to partial discharge. At 30 nm or less, the organic silicon sol itself has an increased transparency.
    When γ-butyrolactone is used as the main dispersant for the organic silicon sol, the compatibility of the sol with the resin solution can be increased to prevent aggregation or increase in viscosity when mixing. The dispersant may contain, mixed with γ-butyrolactone, a polar solvent such as NMP and DMF, aromatic hydrocarbon or lower alcohol to increase stability. However, as the ratio of the mixed solvents increases, the compatibility with the resin solution will decrease. Thus, it is desirable that the γ-butyrolactone ratio be 80% or more.
    The organic silica sol can be prepared by carrying out the solvent replacement for silica sol obtained by hydrolysis of alkoxysilane or by a silica sol obtained by the ion exchange process with water glass (sodium silicate).
    However, the organic silicon sol can be prepared according to other known methods than the methods above.
    An appropriate amount of moisture in the organic silicon sol may be varied depending on the composition of the mixed solvents for the dispersion. However, when the amount is too high, the stability of the sun or the compatibility with the enamel lacquer will generally be lowered. Therefore, the amount of moisture in the organic silica sol is preferably 1.0% or less. Since the organic silica sol dispersed in the solvent having the composition mentioned above is excellent in dispersibility, the silica sol can be obtained with a high concentration of silica of 20% or more.
    Polyamidimide enamel lacquer The polyamide-imide enamel lacquer can be prepared by the synthesis reaction where 4,4'-diphenylmethane diisocyanate (MBI) and trimellitic anhydride (TMA) are reacted at equimolar amounts in a solvent with NMP as the main component, which is typically used from property, cost or material availability aspect. However, if the heat resistance at 200 ° C or more can be maintained in the enamelled polyamidimide line, the raw material structure of aromatic isocyanates, aromatic carboxylic acids and acid anhydrides is not specifically limited. Thus, it can also be prepared by known synthetic methods to react aromatic diamines such as 4.4 g of diaminodiphenylmethane (DAM) with acid chlorides such as trimellitic acid chloride (TMAC).
    The solvent for polyamidimide enamel lacquer can also be γ-butyrolactone as the main component so that the compatibility of the sol with the resin solution can be increased to prevent aggregation or viscosity increase when mixing. the solvent may contain, in admixture with γ-butyrolactone a polar solvent such as NMP and DMF, aromatic hydrocarbon or lower alcohol to enhance stability. However, as the ratio of the mixed solvents increases, the compatibility of the resin solution will decrease. Thus, the ratio of 7-butyrolactone is preferably 60% or more.
    To prepare a resin solution of polyamidimide containing 7-butyrolactone as the main solvent for polyamide-imide, any known method can be used such as: one method is polyamidimide resin synthesized in a solvent having NMP as the main component which precipitates with ethanol to collect only the resin fraction, and then redissolved in γ-butyrolactone; a method in which the resin is synthesized directly in a solvent with γ-butyrolactone as the main component; and a method in which the polyamidimide enamel lacquer is synthesized in a low boiling point solvent such as the DMP and solvent is replaced by 7-butyrolactone in distillation.
    However, the polyamidimide is not synthesized with good reactivity in a solvent of 100% γ-butyrolactone. Therefore, a catalyst such as amines and imidazolines can be used therein. However, since γ-butyrolactone has a solubility for resins lower than NMP, etc., a compound having a biphenyl structure can not be used therein.
    Mixture of organic silicon sol and polyamidimide resin solution Then the organic silicon sol with y-butyrolactone as the main dispersant component is mixed with polyamidimide resin solution with 7-butyrolactone as the main solvent component. The solvent for the resulting enamel lacquer which is resistant to partial discharge may contain, in admixture with γ-butyrolactone, a polar solvent such as NMP and DMF, aromatic hydrocarbon or lower alcohol to enhance the stability. However, as the ratio of mixed solvent increases, the dispersing effect on the silica particles in the enamel lacquer will decrease. Thus, the γ-butyrolactone ratio is preferably 50% or more of the total amount of solvent.
    Insulating varnish that is resistant to partial discharge In general, a resin material that is well dissolved in solvent has transparency even when it is colored. In addition, insulating varnishes for enamelled wires generally have transparency when they do not have a dispersed phase. The reason why transparency is lost by the dispersion particles is that visible light cannot be transmitted because the dispersion particles are large in size. 10 15 20 25 30 35 533 9GB _11- Therefore, it can be easily determined, based on the transparency of the enamel lacquer, whether fine particles are uniformly dispersed or not. In addition, the transparency of the coating film can easily determine whether the fine silica particles are uniformly dispersed in the coating film which is resistant to partial discharge coated on a conductor. Namely, when a predetermined amount of silica is dispersed, the efficiency of the property of partial discharge resistance can be easily determined by the transparency of the coating film.
    In the embodiments of the invention, the polyamide-imide enamel lacquer with γ-butyrolactone is used as the main solvent instead of the conventional polyamidimide enamel lacquer with NMP as the main solvent, and the solvent is the same as the dispersion solvent for the silicon sol. Therefore, the compatibility can be increased so that aggregation between the silica particles, resin precipitation and aggregation between silicon and resin can be prevented in mixing.
    Thus, a uniform lacquer solution with transparency can be obtained.
    When formed into a coating film, a fine insulating coating film with good surface roughness can also be obtained.
    Example Fig. 1 is a cross-sectional view showing an insulated wire in the preferred embodiment according to the invention.
    The insulated tree is structured in such a way that an insulating coating film which is resistant to partial discharge 2 is formed on a conductor 1. It has been manufactured by coating the above-mentioned insulating varnish with resistance to partial discharge around the conductor 1 and then baking it. .
    Fig. 2 is a cross-sectional view showing an insulated conduit in another preferred embodiment of the invention. This insulated conduit has been structured so that an organic insulating coating film 3 is further formed around the insulating coating film with partial discharge resistance 2 shown in Fig. 1 to enhance the mechanical property (the property). slidability, the scratch resistance property, etc.).
    Fig. 3 is a cross-sectional view showing an insulated conduit in another preferred embodiment of the invention.
    The insulated conduit is structured so that an organic insulating coating film 4 is formed on the conductor 1, the insulating coating film resistant to partial discharge 2 is formed on the organic insulating coating film 4, and the organic insulating coating film 3 is further formed around the insulating coating film with resistance to partial discharge 2.
    Method for Manufacturing an Enamelled Line Examples 1-5 and Comparative Examples 1-5 described below are manufactured as follows.
    First, polyamideimide enamel is prepared so that 300 parts by weight of solvent component is added to 100 parts by weight of polyamideimide resin. The organic silica sol is prepared so that 300 parts by weight of the solvent component of the dispersion are added to 100 parts by weight of silica particles with a mean particle diameter of about 12 n.
    Then the organic silicon sol is added to the polyamidimide enamel resin to obtain the insulating varnish with resistance to partial discharge. In this process, a formulation is shaken such that 30 parts by weight of silica is added to 100 parts by weight of the resin portion of the polyamidimide enamel resin to provide an insulating varnish which is resistant to partial discharge. The resulting insulated lacquer which is resistant to partial discharge is coated on a copper conductor with a diameter of 0.8 mm and then baked to provide an enamelled conduit with a coating film thickness of 30 mm. pm. The enamelled pipe is assessed in dimensions, appearance and V ~ t properties.
    The V-t property is a property that indicates the relationship between a breakthrough voltage and a breakthrough time. A voltage of 1 kV with sine waves of 10 kHz is applied between twisted pairs of enamelled wires and the time up to the breakthrough is measured.
    Example 1 The polyamidimide enamel lacquer where 100% of the solvent component is γ-butyrolactone is mixed with the organic silicon sol where 100 of the dispersion solvent component is γ-butyrolactone to provide an insulating lacquer which is resistant to partial discharge. The amount of 7-butyrolactone of the total amount of solvent is 100% by weight.
    Example 2 The polyamidimide enamel lacquer with a mixed solvent where 80% of the solvent component is γ-butyrolactone and 20% thereof is cyclohexane is mixed with the organic silicon sol where the 100% dispersion solution component is γ-butyrolactone to provide an insulating lacquer which is resistant to refractory discharge. The amount of γ-butyrolactone of the total amount of solvent is 84.6% by weight.
    Example 3 The polyamidimide enamel lacquer mixed with a mixed solvent where 85% of the solvent component is γ-butyrolactone and 15% thereof is NMP mixed with the organic silicon sol where 10% of the dispersing solvent component is 7-butyrolactone to provide an insulating varnish that is resistant to partial discharge. The amount of γ-butyrolactone of the total amount of solvent is 89.7% by weight.
    Example 4 The polyamidimide enamel lacquer where 100% of the solvent component is γ-butyrolactone is mixed with the organic silicon sol where 40% of the solvent component of the dispersion is benzyl alcohol and 60% thereof is solvent naphtha to provide an insulating lacquer which is resistant to resistance. charge. The amount of γ-butyrolactone of the total amount of solvent is 76.9% by weight.
    Example 5 The polyamidimide enamel lacquer where 67% of the solvent component is γ-butyrolactone, 10% of which is DMF and 23% of which is cyclohexane mixed with the organic silicon sol where 40% of the solvent component of the dispersion is benzyl alcohol and 60% of it is solvents insulating varnish that is resistant to partial discharge. The amount of γ-butyrolactone of the total amount of solvent is 51.3% by weight.
    Comparative Example 1 The polyamidimide enamel lacquer is 80% of the solvent component than NMP and 20% of it is DMF mixed with the organic silicon sol where 100% of the dispersion solvent component is DMF to provide an insulating lacquer which is resistant to partial discharge. The amount of γ-butyrolactone of the total amount of solvent is 0% by weight. Comparative Example 2 The polyamidimide enamel lacquer is 100% of the solvent component, NMP is mixed with the organic silicon sol where 100% of the dispersion solvent component is DMAC to provide an insulating lacquer which is resistant to partial precipitation. charge. The amount of γ-butyrolactone of the total amount of solvent is 0% by weight.
    Comparative Example 3 The polyamide-imide enamel lacquer is 50% of the solvent component is γ-butyrolactone and 50% of it is NMP mixed with the organic silicon sol where 100% of the dispersion solvent component is DMF to provide an insulating lacquer which is resistant to partial discharge. The amount of γ-butyrolactone of the total amount of solvent is 38.5% by weight.
    Comparative Example 4 The polyamidimide enamel lacquer where 80% of the solvent component is NMP and 20% thereof is DMF is mixed with the organic silicon sol where 100% of the solvent component of the dispersion is 7-butyrolactone to provide an insulating lacquer which is resistant to partial discharge. The amount of 7-butyrolactone of the total amount of solvent is 23.1% by weight.
    Comparative Example 5 The polyamidimide enamel lacquer is obtained where 80% of the solvent component is NMP and 20% thereof is DMF. The amount of γ-butyrolactone of the total amount of solvent is 0% by weight.
    Table 1 shows the properties of the lacquer in examples 1-5 and comparative examples 1-5, as well as the properties (dimensions, appearance and V-t properties) of the enamelled wires manufactured using the lacquer.
    Table 1, on page 17, contains, as it later turned out, some incorrect values. kšëšlæß 533 966 W ä * M A 'g fi šls-fæ; : ga: s ß a »êáëlšš šuškqw 34% ææßkw go egg ä" ëh fifl išë fi äëi fifi ”få ä fi ß ß à šš å | ß % |. 10 15 20 25 533 966 _13- From the results in table 1 one finds that the insulating varnishes - those which are resistant to partial discharge in examples 1-5, which have 50% or more by weight of γ-butyrolactone of the total amount of solvent, are transparent and have good stability. resistant to partial discharge in Comparative Examples 1 ~ 4, which have less than 50% by weight of γ-butyrolactone of the total amount of solvent, aggregated and cloudy, and not having good precipitation stability.
    In addition, it has been found that enamelled wire in Examples 1-5 is transparent in appearance and has excellent V-t properties, compared with those in Comparative Examples 1-5.
    In addition, it is found that the insulating varnishes which are resistant to partial discharge in Examples 1-5 with the enamel lacquer composition where γ-butyrolactone is 60% or more of the solvent component are transparent in appearance and have excellent stability. In addition, it is found that the enamelled pipe that uses these varnishes is transparent in appearance and has excellent V-t properties. Although the invention has been described with respect to the specific embodiments for a complete and clear disclosure, the appended claims are not to be limited thereto but are to be construed as including all modifications and alternative constructions which may occur to one skilled in the art which fall within the scope of the teachings presented. hair.
    权利要求:
    Claims (1)
    [1]
    NEW PATENE-RXmxv Insulating lacquer resistant to partial discharge comprising: a polyamidimide enamel lacquer comprising 7-butyrolactone as a major solvent and an organic silicon sol comprising γ-butyrolactone as a major dispersion solvent, the polyamidimide enamel lacquer and the organic silicon sol being dispersed in solvent comprising 50 to 100% by weight of γ-butyrolactone. An insulating varnish which is resistant to partial discharge according to claim 1, wherein: a silica component in the organic silica sol is 1 to 100 phr (parts per hundred parts of resin) by the weight of a resin component in the polyamidimide enamel lacquer. An insulating varnish which is resistant to partial discharge according to claim 1, wherein: the organic silicon sol has an average particle size of 100 nm or less. Insulated wire comprising: a conductor; and an insulating coating film which is resistant to partial discharge formed on the surface of the conductor, wherein the insulating coating film which is resistant to partial discharge is made of an insulating varnish which is resistant to partial discharge as defined in claim 1. Insulated wire according to claim 1. claim 4, further comprising: an organic insulating coating film formed on the surface of the conductor, 10 53 20 96 30 gLÛ wherein the insulating coating film resistant to partial discharge is formed on the surface of the organic insulating coating film . The insulated conduit of claim 4, further comprising: an additional organic insulating coating film formed on the surface of the insulating coating film that is resistant to partial discharge. The insulated conduit of claim 5, further comprising: an additional organic insulating coating film formed on the surface of the insulating coating film that is resistant to partial discharge. A method of making an insulating varnish which is resistant to partial discharge which comprises: mixing a polyamidimide enamel lacquer with an organic silicon sol, wherein the polyamidimide enamel lacquer comprises γ-butyrolactone as the main solvent, the organic silicon sol comprises y-butyrol actone as the main dispersion solvent and the insulating varnish which is resistant to partial discharge comprises 50 to 100% by weight of γ-butyrolactone of the total amount of solvent thereof. The method of claim 8 wherein: the polyamidimide enamel lacquer comprises 60 to 100 weight percent γ-butyrolactone of the total amount of the solution amount thereof. Method according to claim 8, wherein: ll. The organic silica sol comprises 80 to 100% by weight of γ-butyrolactone of the total amount of dispersion solvent thereof. A method of manufacturing an insulated conduit, comprising: preparing an insulating varnish which is resistant to partial discharge by mixing a polyamidimide enamel varnish with an organic silica sol; and coating the insulating lacquer resistant to partial discharge on the surface of a conductor and then baking the lacquer to form a coating film on the conductor, wherein the polyamidimide enamel lacquer comprises γ-butyrolactone as a main solvent, wherein the organic silicon sol comprises γ-butyrolactone as the main dispersion solvent, and where the insulating varnish which is resistant to partial discharge comprises 50 to 100% by weight of γ-butyrolactone of the total amount of solvent thereof. The method of claim 11, further comprising: forming an organic insulating coating film on the surface of the conductor, wherein the insulating coating film that is resistant to partial discharge is formed on the surface of the organic insulating coating film.
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    同族专利:
    公开号 | 公开日
    ES2301351A1|2008-06-16|
    JP2006299204A|2006-11-02|
    US20060240254A1|2006-10-26|
    US9080073B2|2015-07-14|
    SE0600890L|2006-10-26|
    DE102006006151A1|2006-10-26|
    CN1854221A|2006-11-01|
    CN100465241C|2009-03-04|
    US20130236638A1|2013-09-12|
    KR100656867B1|2006-12-14|
    FR2884825B1|2010-12-31|
    ES2301351B2|2008-12-01|
    US8871343B2|2014-10-28|
    ITMI20060784A1|2006-10-26|
    DE102006006151B4|2009-01-22|
    FR2884825A1|2006-10-27|
    KR20060112594A|2006-11-01|
    JP4542463B2|2010-09-15|
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    JP2005126810A|JP4542463B2|2005-04-25|2005-04-25|Partially discharge-resistant insulating paint, insulated wire, and method for producing the same|
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